Interconnections and packages

Crosstalk between interconnect lines is a phenomenon increasingly important in modern integrated circuit technologies. Our work studies this phenomenon in several aspects:

- Optimum line modeling, studying inductive effects in VLSI interconnections.
- Crosstalk modeling and analysis.
- Measurement of crosstalk effects.
- Propagation of spurious signals caused by crosstalk. Circuit immunity to crosstalk.

A related area, also included in the general area of signal integrity, is the study of packaging in the transmission of signals. Our main interest is in the electrical modeling of packages using electrical and electromagnetic simulation, and the study of simultaneous switching noise and power distribution inside the package.